발진기
| 사진 | 제조사 부품번호 | 재고 여부 | 수량 | 데이터시트 | 시리즈 | 패키지/케이스 | 패키징 | 제품 상태 | 베이스 공진기 | 유형 | 주파수 | 기능 | 출력 | 전압 - 공급 | 주파수 안정성 | 절대 당김 범위(APR) | 작동 온도 | 스프레드 스펙트럼 대역폭 | 전류 - 공급(최대) | 정격 | 장착 유형 | 공급자 장치 패키지 | 크기/치수 | 높이 - 앉은 상태(최대) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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DSA6101MA1B-050.0000VAOMEMS OSC., AUTOMOTIVE, LOW POWER Microchip Technology |
7,027 |
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DSA61XX | 4-VFLGA | Bag | Active | MEMS | XO (Standard) | 50 MHz | Enable/Disable | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 125°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (2x1.6) | 0.079" L x 0.063" W (2.00mm x 1.60mm) | 0.035" (0.89mm) |
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DSA1003DI3-024.0000TVAOMEMS OSC., AUTOMOTIVE, LOW POWER Microchip Technology |
3,779 |
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DSA1003 | 4-VDFN | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 24 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±20ppm | - | -40°C ~ 85°C | - | 8mA | AEC-Q100 | Surface Mount | 4-CDFN (2.5x2) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
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DSA1103CA3-100.0000TVAOMEMS OSC, AUTO, LVDS, 100MHZ, 20 Microchip Technology |
3,814 |
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DSA1103 | 6-VDFN | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 100 MHz | Standby (Power Down) | LVDS | 3.3V | ±20ppm | - | -40°C ~ 125°C | - | 32mA | AEC-Q100 | Surface Mount | 6-VDFN (3.2x2.5) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
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DSC1103NL2-322.0000TMEMS OSC, LVDS, 322MHZ, 25PPM, 2 Microchip Technology |
5,733 |
|
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DSC1103 | 6-VDFN | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 322 MHz | Standby (Power Down) | LVDS | 3.3V | ±25ppm | - | -40°C ~ 105°C | - | 32mA | - | Surface Mount | 6-CDFN (7x5) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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DSA6111JA2B-040.0000VAOMEMS OSC, AUTO,LVCMOS, 40MHZ, 25 Microchip Technology |
7,223 |
|
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DSA61XX | 4-VLGA | Tube | Active | MEMS | XO (Standard) | 40 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 125°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 4-VLGA (2.5x2) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.89mm) |
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HTM6101JL1B-012.0000HIGH TEMP MEMS BASED XO +3.3 VDC Microchip Technology |
2,420 |
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HTM61XX | 4-VLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 12 MHz | Enable/Disable | CMOS | 1.8V, 2.5V, 2.8V, 3V, 3.3V | ±50ppm | - | -40°C ~ 105°C | - | 4mA (Typ) | - | Surface Mount | 4-VLGA (2.5x2) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.89mm) |
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M921223NI1-25M00000MEMS BASED XO +2.5 VDC +/-5% LVD Microchip Technology |
6,600 |
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M9212X3 | 6-VDFN | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 25 MHz | Enable/Disable | LVDS | 2.5V, 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 32mA (Typ) | - | Surface Mount | 6-VDFN (7x5) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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HTM6101CI1B-027.0000HIGH TEMP MEMS BASED XO +3.3 VDC Microchip Technology |
7,739 |
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HTM61XX | 4-VDFN | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 27 MHz | Enable/Disable | CMOS | 1.8V, 2.5V, 2.8V, 3V, 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 4mA (Typ) | - | Surface Mount | 4-VDFN (3.2x2.5) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
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M906111CI1B-050.0000MEMS BASED XO +1.8 VDC -40C TO + Microchip Technology |
8,897 |
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M9061XX | 4-VDFN | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 50 MHz | Standby (Power Down) | CMOS | 1.8V, 2.5V, 2.8V, 3V, 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 4mA (Typ) | - | Surface Mount | 4-VDFN (3.2x2.5) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
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HTM6101AA3B-025.0000HIGH TEMP MEMS BASED XO +3.3 VDC Microchip Technology |
3,267 |
|
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HTM61XX | 4-VDFN Exposed Pad | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 25 MHz | Enable/Disable | CMOS | 1.8V, 2.5V, 2.8V, 3V, 3.3V | ±20ppm | - | -40°C ~ 125°C | - | 4mA (Typ) | - | Surface Mount | 4-VDFN (7x5) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
