발진기
| 사진 | 제조사 부품번호 | 재고 여부 | 수량 | 데이터시트 | 시리즈 | 패키지/케이스 | 패키징 | 제품 상태 | 베이스 공진기 | 유형 | 주파수 | 기능 | 출력 | 전압 - 공급 | 주파수 안정성 | 절대 당김 범위(APR) | 작동 온도 | 스프레드 스펙트럼 대역폭 | 전류 - 공급(최대) | 정격 | 장착 유형 | 공급자 장치 패키지 | 크기/치수 | 높이 - 앉은 상태(최대) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
DSC6101HI2B-027.0000MEMS OSC, LVCMOS, 27MHZ, 25PPM, Microchip Technology |
9,803 |
|
|
DSC61XXB | 4-VFLGA | Bag | Active | MEMS | XO (Standard) | 27 MHz | Enable/Disable | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
|
DSA6101JA1B-050.0000VAOMEMS OSC, AUTO, LVCMOS, 50MHZ, 5 Microchip Technology |
7,708 |
|
|
DSA61XX | 4-VLGA | Tube | Active | MEMS | XO (Standard) | 50 MHz | Enable/Disable | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 125°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 4-VLGA (2.5x2) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.89mm) |
|
DSC6312JE1EB-080.0000MEMS OSC, LVCMOS, 80MHZ, 50PPM, Microchip Technology |
7,134 |
|
|
DSC63XXB | 4-VLGA | Tube | Active | MEMS | XO (Standard) | 80 MHz | Standby (Power Down) | LVCMOS | 1.8V ~ 3.3V | ±50ppm | - | -20°C ~ 70°C | ±2.00%, Center Spread | 3mA (Typ) | AEC-Q100 | Surface Mount | 4-VLGA (2.5x2) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.89mm) |
|
DSC1121NM1-100.0000MEMS OSC., LOW JITTER, 100MHZ, L Microchip Technology |
2,545 |
|
|
DSC1121 | 6-VDFN | Tube | Active | MEMS | XO (Standard) | 100 MHz | Enable/Disable | CMOS | 2.25V ~ 3.6V | ±50ppm | - | -55°C ~ 125°C | - | 35mA | - | Surface Mount | 6-CDFN (7x5) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
|
DSC6301JI2AB-033.3333MEMS OSC, LVCMOS, 33.3333MHZ, 25 Microchip Technology |
5,322 |
|
|
DSC63XXB | 4-VLGA | Tube | Active | MEMS | XO (Standard) | 33.3333 MHz | Enable/Disable | LVCMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | ±0.25%, Center Spread | 3mA (Typ) | AEC-Q100 | Surface Mount | 4-VLGA (2.5x2) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.89mm) |
|
DSC6311JL3AB-001.0000TSPREAD SPECTRUM MEMS OSC., +-0.2 Microchip Technology |
8,977 |
|
|
DSC63XXB | 4-VLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 1 MHz | Standby (Power Down) | LVCMOS | 1.8V ~ 3.3V | ±20ppm | - | -40°C ~ 105°C | ±0.25%, Center Spread | 3mA (Typ) | AEC-Q100 | Surface Mount | 4-VLGA (2.5x2) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.89mm) |
|
DSC6111HA3B-025.0000MEMS OSC, LVCMOS, 25MHZ, 20PPM, Microchip Technology |
2,919 |
|
|
DSC61XXB | 4-VFLGA | Bag | Active | MEMS | XO (Standard) | 25 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±20ppm | - | -40°C ~ 125°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (1.6x1.2) | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 0.035" (0.89mm) |
|
DSA6331MA1DB-020.0000TVAOSPREAD SPECTRUM OSC. FOR AUTO., Microchip Technology |
9,664 |
|
|
DSA63XX | 4-VFLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 20 MHz | - | LVCMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 125°C | ±1.50%, Center Spread | 3mA (Typ) | AEC-Q100 | Surface Mount | 4-VFLGA (2x1.6) | 0.079" L x 0.063" W (2.00mm x 1.60mm) | 0.035" (0.89mm) |
|
DSA6111AI1B-049.1520VAOMEMS OSC, AUTO,LVCMOS, 49.152MHZ Microchip Technology |
5,564 |
|
|
DSA61XX | 4-VDFN Exposed Pad | Tube | Active | MEMS | XO (Standard) | 49.152 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 4-VDFN (7x5) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
|
DSA1001DL2-001.5625TVAOMEMS OSC., AUTOMOTIVE, LOW POWER Microchip Technology |
4,828 |
|
|
DSA1001 | 4-VDFN | Tape & Reel (TR) | Active | MEMS | XO (Standard) | 1.5625 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 105°C | - | 8mA | AEC-Q100 | Surface Mount | 4-CDFN (2.5x2) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
